Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Philippe Bois"'
Autor:
Chin Chong Yap, Dominique Baillargeat, Jean-Luc Reverchon, David Hee, Dunlin Tan, Beng Kang Tay, Philippe Bois, JongJen Yu
Publikováno v:
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, May 2013, United States. pp.154-158
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, May 2013, United States. pp.154-158
In next generation sensing architectures, compact systems that could enhance manoeuvrability and at the same time diversify sensing capability is similarly carried out through pitch size reduction to incorporate more pixels per unit area. This is bec