Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Joon Seok Oh"'
Autor:
Yoonyoung Jeon, Youngmin Kim, Minju Kim, Sangyun Lee, Hyundong Lee, Changbo Lee, Joon Seok Oh
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Autor:
Joon Seok Oh, Yoon Young Jeon, Changbo Lee, Sangyun Lee, Young-Min Kim, Hyun-Dong Lee, Minju Kim
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Since InFO WLP (Integrated Fan-out wafer level package) technology was successfully launched on the packaging field in 2016, the interest in fan-out package technology has increased significantly due to small footprint, enhanced speed gain and power