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Publikováno v:
IEEE transactions on biomedical circuits and systems [IEEE Trans Biomed Circuits Syst] 2016 Feb; Vol. 10 (1), pp. 1-2.
Publikováno v:
IEEE transactions on neural systems and rehabilitation engineering : a publication of the IEEE Engineering in Medicine and Biology Society [IEEE Trans Neural Syst Rehabil Eng] 2012 Mar; Vol. 20 (2), pp. 113-6.
Publikováno v:
IEEE Access, Vol 12, Pp 1360-1373 (2024)
Software engineering (SE) and computer science (CS) programs in universities worldwide are marked by a gender gap, which subsequently translates into a gender gap at the industry level. However, there are positive activities that can help attract mor
Externí odkaz:
https://doaj.org/article/788524c42eff47f68b6849303422154a
Publikováno v:
IEEE Access, Vol 11, Pp 135147-135158 (2023)
Digital Twins possess the capability to create virtual representations of a device’s components and dynamics. They transcend static images or blueprints, offering intricate models that reveal the entire lifecycle of system design, construction, and
Externí odkaz:
https://doaj.org/article/e96074ef5ac44fc3ad7f29b494351ec0
Autor:
Alexey Osipov, Ekaterina Pleshakova, Artem Bykov, Oleg Kuzichkin, Dmitry Surzhik, Stanislav Suvorov, Sergey Gataullin
Publikováno v:
IEEE Access, Vol 11, Pp 60349-60364 (2023)
The purpose of the article is to create an effective method to monitor the state of the drill string and the bit without interfering with the drilling process itself in low-time delay mode. For continuous monitoring of the well drilling process, an e
Externí odkaz:
https://doaj.org/article/3269fa57095740a9857d654d85bbf994
Autor:
Herkert, Joseph, Andrews, Clinton J.
Publikováno v:
IEEE Technology & Society Magazine; Sep2023, Vol. 42 Issue 3, p118-120, 3p
Autor:
Liu, Gang, Wang, Jing
Publikováno v:
IEEE Transactions on Cybernetics; Dec2022, Vol. 52 Issue 12, Part 2, p13774-13787, 14p
Publikováno v:
IEEE Transactions on Power Delivery; Dec2022, Vol. 37 Issue 6, p5203-5213, 11p
Publikováno v:
IEEE Electron Device Letters; Dec2022, Vol. 43 Issue 12, p2180-2183, 4p
Autor:
Richstein, B., Han, Y., Zhao, Q., Hellmich, L., Klos, J., Scholz, S., Schreiber, L. R., Knoch, J.
Publikováno v:
IEEE Electron Device Letters; Dec2022, Vol. 43 Issue 12, p2149-2152, 4p