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Autor:
T.H. Ng, Y.Z. Zhao, H. Feng, J. Lam, Y.M. Huang, R. He, D.D. Wang, M.K. Dawood, H. H. Yap, P.K. Tan, H. Tan, Y. Zhou, G.R. Low, Z.H. Mai
Publikováno v:
International Symposium for Testing and Failure Analysis.
Top-down, layer-by-layer de-layering inspection with a mechanical polisher and serial cross-sectional Focused Ion Beam (XFIB) slicing are two common approaches for physical failure analysis (PFA). This paper uses XFIB to perform top-down, layer-by-la