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pro vyhledávání: '"Sunjung, Kim"'
Autor:
Sunjung Kim, Kang O Kim
Publikováno v:
Journal of Nanoscience and Nanotechnology. 16:5173-5178
Cu-Ag alloy interconnect is promising for ultra-large-scale integration (ULSI) microelectronic system of which device dimension keeps shrinking. In this study, seedless electrodeposition of Cu-Ag alloy directly on W diffusion barrier as interconnect
Autor:
Sunjung Kim, Bora Ye
Publikováno v:
Journal of Nanoscience and Nanotechnology. 15:8217-8221
Cu–Sn alloy foam is a promising electrode material for Li-ion batteries. In this study, Cu–Sn alloy foam was produced by diffusion-limited electrodeposition in alkaline electrolyte using polyurethane (PU) foam template. Our major concern is to fo