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Publikováno v:
ACS Omega, Vol 4, Iss 4, Pp 6092-6096 (2019)
ACS Omega
ACS Omega
By using pulse electrodeposition, a copper nanopillar array (CuNPA) was filled into porous anodized aluminum oxide (AAO) films to achieve a highly thermal conductive interconnector with anisotropic property. After 120 min pulse deposition, CuNPA unif