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Publikováno v:
Micromachines, Vol 11, Iss 6, p 544 (2020)
Silicon wafer with high surface quality is widely used as substrate materials in the fields of micromachines and microelectronics, so a high-efficiency and high-quality polishing method is urgently needed to meet its large demand. In this paper, a di
Externí odkaz:
https://doaj.org/article/f6a4aa52e0d74c8fb7f1bb7666ec5fcc