Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Long Zhang"'
Publikováno v:
Journal of Electronic Materials. 52:3321-3333
Publikováno v:
Journal of Electronic Materials. 51:6002-6010
Effect of Cu Addition on the Microstructure and Mechanical Properties of Sn-58Bi-0.5Ag Solder Alloys
Publikováno v:
Journal of Electronic Materials. 51:3552-3559
Autor:
Long Zhang, Hehe Zhang, Limeng Yin, Gang Wang, Zilong Su, Yupeng Zhang, Zongxiang Yao, Zhongwen Zhang, Cunguo Zuo
Publikováno v:
Journal of Electronic Materials. 49:7394-7399
Low silver Sn-0.3Ag-0.7Cu (SAC0307) composite solder reinforced with graphene nanosheets (GNs) was prepared by powder metallurgy techniques, and the effects of GN content on the melting characteristics, wettability, microhardness and shear strength o
Publikováno v:
Journal of Electronic Materials. 46:2860-2866
Type I clathrates are a promising thermoelectric (TE) material for waste heat recovery applications. However, the TE figure-of-merit of type I clathrates still needs further improvement. In this study, Yb-doped Ba8−xYbxNi0.1Zn0.54 Ga13.8Ge31.56 (0
Publikováno v:
Journal of Electronic Materials. 41:1601-1605
Our previous work identified thermal instability of p-type skutterudite as a primary cause of degradation during thermoelectric generator operation at 650°C. Residual Sb in the microstructure was believed to be the cause of diminished thermal stabil