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Publikováno v:
In International Journal of Thermal Sciences December 2021 170
Publikováno v:
International Journal of Thermal Sciences. 170:107145
The ever-increasing performance of thin portable electronic products has made their heat dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra-thin vapor chamber (UTVC) with six spiral woven meshes and single-lay