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pro vyhledávání: '"Pengzhan Li"'
Autor:
Lei Xu, Kihong Park, Hong Lei, Pengzhan Liu, Eungchul Kim, Yeongkwang Cho, Taesung Kim, Chuandong Chen
Publikováno v:
Friction, Vol 11, Iss 9, Pp 1624-1640 (2023)
Abstract The material loss caused by bubble collapse during the micro-nano bubbles auxiliary chemical mechanical polishing (CMP) process cannot be ignored. In this study, the material removal mechanism of cavitation in the polishing process was inves
Externí odkaz:
https://doaj.org/article/8643f077f9bc4648adb74a5e848d7c3a