Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Huang, Guangwen"'
Publikováno v:
In Applied Thermal Engineering 5 March 2020 168
Publikováno v:
In Applied Thermal Engineering 25 February 2020 167
Publikováno v:
In Applied Thermal Engineering 5 November 2019 162
Publikováno v:
Applied Thermal Engineering. 168:114889
With the rapid development of photoelectric products, their miniaturization and high integration have intensified the problem of heat dissipation. In this paper, a new type of bionic vapor chamber is designed and manufactured. The wick structure for
Publikováno v:
Applied Thermal Engineering. 167:114726
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm thick) with four spiral woven meshes and one bottom mesh composite wick