Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Himani Sharma"'
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper presents a novel set of low-cost materials and processes to fabricate thinfilm decoupling capacitors on silicon and glass substrates, using printed valve-metal electrodes. The valve-metals such as Al and Ta allow for easy formation of conf
Autor:
Rao Tummala, Saumya Gandhi, P. Markondeya Raj, Madhavan Swaminathan, Himani Sharma, Venky Sundaram
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper presents a new active and passive integration concept called 3D IPAC (Integrated Actives and Passives) to address the power integrity in high-performance and multifunctional systems. The 3D IPAC consists of an ultra-thin glass module with
Autor:
P. Markondeya Raj, T. Danny Xiao, Uei-Ming Jow, K. P. Murali, Jinxiang Dai, Dibyajat Mishra, Saumya Gandhi, Himani Sharma, Rao Tummala, Maysam Ghovanloo
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
This paper describes an innovative 3D IPAC (Integrated Passive and Active Components) concept for ultra-miniaturized and highly-functional sub-systems, going beyond discrete passives and Integrated Passive Devices (IPDs). The 3D IPAC concept consists