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Autor:
R.J. Pimpinella
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
A new type of fiber-optic connector designed to meet military stress requirements has been demonstrated. This reliable optical card-edge (ROC) connector is a multifiber backplane connector (four fiber, blind mate). The connector uses a unique, expand
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
A comparison of conventional single-chip on high-density printed wiring board (PWB) packaging with both ceramic and silicon-substrate multichip module (MCM) strategies is presented. Both approaches are assessed given current state-of-the-art manufact
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
An MCM (multichip module) architecture that could permit the assembly of low-cost, high-performance modules based on the existing manufacturing infrastructure is described, and results from an initial investigation of a few key issues are reported. H
Autor:
V.K. Nagesh, D. Miller
Publikováno v:
1992 Proceedings 42nd Electronic Components & Technology Conference.
Trends in packaging technologies are reviewed. It is suggested that advanced packaging solutions such as multichip modules (MCMs) will make possible future high-performance workstations. High I/O count, signal frequency, integrity, and power and low