Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Huang, Guangwen"'
Publikováno v:
International Journal of Thermal Sciences. 170:107145
The ever-increasing performance of thin portable electronic products has made their heat dissipation issues more and more severe, or even become failure. A novel 0.5 mm thick ultra-thin vapor chamber (UTVC) with six spiral woven meshes and single-lay
Autor:
Li, Huixia, Liu, Jiahui, Tan, Danfeng, Huang, Guangwen, Zheng, Jianfei, Xiao, Juan, Wang, Hua, Huang, Qun, Feng, Na, Zhang, Guoqiang
Publikováno v:
Medicine
This study described the prevalence of adverse pregnancy outcomes (APOs) in Chinese HIV-infected pregnant women, and examined the relationship between maternal HIV infection /HIV-related factors and APOs. This prospective cohort study was carried out
Publikováno v:
International Journal of Heat and Mass Transfer. 176:121467
The rapid development of high-performance portable electronics requires ultra-thin heat pipes (UTHPs) with higher heat transfer capacity to meet their heat dissipation needs. Wick structure, the key component of a heat pipe, makes a decisive role in
Publikováno v:
Applied Thermal Engineering. 168:114889
With the rapid development of photoelectric products, their miniaturization and high integration have intensified the problem of heat dissipation. In this paper, a new type of bionic vapor chamber is designed and manufactured. The wick structure for
Publikováno v:
Applied Thermal Engineering. 167:114726
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat dissipation requirement of miniaturized electronics. In this study, a novel UTVC (0.5 mm thick) with four spiral woven meshes and one bottom mesh composite wick
Publikováno v:
International Journal of Heat and Mass Transfer. 148:119101
With the miniaturization and integration of portable devices, ultra-thin vapor chamber (UTVC) is required to have thinner thickness and better heat transfer performance. However, the reduction in thickness usually causes a decrease in heat transfer c
Publikováno v:
Applied Thermal Engineering. 162:114263
Ultra-thin vapor chamber (UTVC) is an efficient heat transfer element that meets the heat dissipation requirement of miniaturized electronics. In this study, cost-effective mesh-type UTVCs (total thickness: 1.26–1.77 mm) were fabricated and investi
Publikováno v:
Materials & Design (1980-2015). 56:822-832
This study presents a finite element (FE) analysis of the tube sinking of a thin-walled copper tube through a radial forging process (RFP) with two- and three-split dies without mandrel. Three-dimensional FE models of two-split dies RFP and three-spl