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Publikováno v:
Laine-Ma, T, Ruuskanen, P, Kortet, S & Karttunen, M 2009, ' Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards ', Circuit World, vol. 35, no. 4, pp. 22-30 . https://doi.org/10.1108/03056120911002389
PurposeThe adhesion between electroless copper and a substrate is one of the most important factors in the reliability of thermoplastic printed circuit boards. The purpose of this paper is to investigate the effects of mechanical grinding and acid et